"The first is confirmation that the rumor I shared in April that Omnivision (NASDAQ: OVTI) would win a 3MP image sensor design in the next generation iPhone. It appears the tear down report published by EE Times has confirmed this win.

"The second is that Broadcom (NASDAQ: BRCM) displaced both the CSR Bluetooth and Marvell (NASDAQ: MRVL) WiFi chips with its BCM4325 that supports both functions in a single chip.

"The third is confirmation that SkyWorks (NASDAQ: SWKS) in fact is the power amp supplier. I noted this in my first report on the new iPhone 3G S even though none of the early tear down reports mentioned the design. What tipped me off was a very faint SWKS logo showing through in a photograph.

"TriQuint Semiconductor (NASDAQ: TQNT) won the three duplexer sockets. Infinion (NASDAQ: IFNNY) appears to have retained the four sockets it had in the last iPhone design, the baseband processor, some power management and the GPS chip.

"And STMicroelectronics (NYSE: STM) also maintained its MEMS design that facilitates the changing screen orientations as users rotate the phone from portrait to landscape modes.

"The monstrous NAND Flash, which includes 128Gb in a single package (actually four 32Gb die stacked) contains chips showing the logo from Sandisk (NASDAQ: SNDK).

"This Sandisk/Toshiba package is the largest single package memory I've ever seen and is easily enough memory to support a nice netbook application let alone the needs of a smartphone.

"For disclosure, at the time of this publication, we hold long positions in Apple, STMicro, Sandisk, and SkyWorks."

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